項目                                       說明

鐳射種類                                 ND:YAG Laser

鐳射波長                                 1064nm/532nm/355nm/266nm

鐳射功率(*大輸出)                        0.5mJ/pulse

Peak Power                               100W

1064波幅                                 4-6nsec

發(fā)振頻率                                 1-50Hz

冷卻方法                                 水冷式

輸出能量控制                             1000 steps for 0-100%※Hi/Low switch-able

Flash Lamp Life time                        1年或大于10000000shots

鐳射器保固期                              1年

介面                                     RS-232

(依實際鐳射配置規(guī)格為準(zhǔn))

1 Laser Slit

      項目                                       說明

                                       物鏡倍率      加工尺寸

     修補尺寸                          NIR 50x 物鏡    min: 1um x1um

                                     NIR 20x 物鏡    max: 120um x 120um

2 光學(xué)影像系統(tǒng)

項目                                             說明

顯微鏡                                        觀測/鐳射加工專用型

CCD                                          1/2”Color CCD

落射光源                                      高亮度鹵素光源系統(tǒng)(100W)

透射光源                                      高亮度鹵素光源系統(tǒng)(150W)

Guide Light                                    高亮度鹵素光源系統(tǒng)(100W)

物鏡切換系統(tǒng)                                  4孔/電動切換式(線性)

3 精密物鏡組

項目                                           說明

M Plan APO 5 x                                 觀察

M Plan APO 10 x                                觀察

M Plan NIR 20 x                                觀察/鐳射加工

M Plan NIR 50 x                                觀察/鐳射加工

4 自動對焦系統(tǒng)

項目                                           說明

對焦類型                                     手動式對焦

5 加工載臺

項目                                           說明

主要功能                                      工件承載使用

材質(zhì)                                          精密大理石平臺

尺寸                                          400mm x 300mm

底座                                          大理石底座